Dycotec Materials to Showcases Cutting-Edge Printed Electronics Innovations at LOPEC 2025
17 February 2025: Dycotec Materials is exhibiting at LOPEC 2025, the world’s leading exhibition and conference for printed electronics, taking place from 25-27 February at ICM Munich, Germany. As a pioneer in advanced material solutions, Dycotec will showcase its latest breakthroughs in conductive inks, encapsulants, and functional coatings designed for a wide range of applications, including wearable technology, automotive electronics, and next-generation photovoltaics.
At Booth B0.100, visitors will have the opportunity to explore Dycotec’s latest product developments, including new developments in its range of products for flexible, stretchable and In-Mold Electronics. With a focus on enhancing performance, reducing costs, and increasing sustainability, these materials are shaping the future of printed electronics.
Dycotec will at the LOPEC Conference, where its experts will share insights into the advancements in …
– Polyimide forming inks for exceptional performance in high temperature applications including heaters and sensors for use in the automotive and aerospace industries
– Die sinter attach materials
– Range of new biosensor inks with high performance carbon, solid state electrolytes. Silver-silver chloride and junction layers suitable for electrochemical sensor fabrication
In addition to its conductive inks, Dycotec will showcase its latest thick film pastes, which offer superior electrical performance and durability for a variety of applications. These pastes are designed for hybrid circuits, sensors, and power electronics, providing robust solutions that enhance product reliability and longevity. By leveraging its expertise in material formulation, Dycotec continues to develop high-quality, customisable thick film solutions that meet the evolving needs of the electronics industry. New products released in 2024 include …
– Gold paste suitable for general purpose use including biosensors, suitable for wire bonding and fine line printing.
– Screen-printable fritted platinum conductor paste producing a highly conductive, dense layer suitable for a range of applications including zirconia oxygen sensors.
– Overglaze suitable for printing over resistors in hybrid circuits resistant to acids, is also lead and cadmium free.
– Range of new high resolution silver pastes including paste for flexible applications curable at low temperatures. Solderable silver cermet paste suitable for chip resistors, hybrid circuits, potentiometers, and heaters.
LOPEC is a crucial event for Dycotec to connect with industry leaders, collaborate on future technologies, and showcase the real-world impact of its latest materials. The company looks forward to engaging with partners and customers to drive innovation in printed and flexible electronics.
info@dycotecmaterials.com
