DuPont to Feature Innovative Electronics Products and Solutions at Electronica 2024
13 November 2024: As the demand for advanced technology surges, DuPont will be featuring its extensive portfolio of innovative products and solutions at Electronica 2024, the world’s premier trade fair for electronics, November 12-15 in Munich. Meet us at the nexus of innovation: Hall B3, Stand Number 562 and discover our transformative vision for the electronics landscape under the banner “One Stop Powerhouse for Advanced Interconnect and Thermal Management.”
“Electronica 2024 is a pivotal platform for showcasing our commitment to innovation in the electronics sector,” said Sebastien Chaudet, Europe General Manager for DuPont Interconnect Solutions. “We’re eager to connect with industry leaders, partners and customers to discuss how our advanced technologies can propel your projects forward and drive mutual success.”
DuPont booth promises to be a treasure trove of exciting, pioneering products and solutions tailored to meet the dynamic demands of the electronics sector. Several products and technologies will be on display, including:
– Laird Performance Materials provide electronic devices with innovative protection solutions in electromagnetic and thermal management across industries such as automotive, aerospace, medical, computing, telecom, AI, datacenter and more.
– Solderon™ and Silveron™ metallization processes address the connector industry’s needs for critical component reliability, ensuring signal integrity and low contact resistance with sustainable, durable, high-efficiency, and cost-optimized plating solutions.
– Silver Nanowire Technologies enable transparent conductors (inks and films) with ultra-flexibility and excellent optics ideal for transparent heater, display touch, shielding, and more in next-generation automotive and display technologies.
– Pyralux® Flexible Laminates provide exceptional flexibility and high thermal performance, making them ideal for multilayer circuits, ensuring reliability and efficiency in applications ranging from automotive to telecommunications.
In addition to our extensive product lineup, we are excited to present an immersive multimedia experience featuring:
– Advanced Computing and AI Solutions: DuPont develops and manufactures products of unmatched quality and reliability under two powerhouse portfolios, advanced interconnect and thermal management, that address the complex performance demands of AI chip packaging and boards and enable future innovation.
Next-Generation Automotive Applications: Learn about our specialized materials designed for electric vehicles and autonomous driving technologies that focus on safety and efficiency.
Printed Circuit Boards: Discover how our advanced solutions ranging from advanced packages, Integrated Circuit (IC) substrates, and rigid (flexible) printed circuit solutions are essential for ensuring reliability and performance in addressing thermal management and signal integrity challenges.
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