DuPont Showcases Leading Innovations in Advanced Circuit Materials and Solutions at TPCA Show 2023 in Taipei
01 November 2023: Interconnect Solutions (ICS), part of DuPont Electronics & Industrial, a total solution and system design partner exhibited its broad portfolio of advanced circuit materials and solutions at Taiwan Printed Circuit Association (TPCA) Show at Taipei Nangang Exhibition Center from October 25-27, 2023.
With the advancements of Artificial Intelligence (AI), Machine Learning (ML) and 5G networks, there is a growing demand for high-speed and high-frequency devices to meet the rapid development of data generation. Printed Circuit Board (PCB) industry is facing significant challenges and trends in miniaturization and increased functionality of electronic devices.
“At DuPont, we have built strong capabilities globally in the PCB industry and across the value chain,” said Yuanyuan Zhou, global business director, Metallization & Imaging, ICS. “We been developing industry-leading advanced metallization chemistries that enable the fast-growing AI applications. Furthermore, with the latest integration of machine learning in our product design, we are able to accelerate our speed to market and offer novel solutions that streamline the design process, increase manufacturing yield and enhance the overall efficiency.”
DuPont’s total solution offerings for the substrate and PCB market enable design engineers to apply high-performing materials and advanced chemistry to flex, rigid-flex, rigid PCB, and IC substrate configurations for higher performance and efficiency. With innovative solutions for IC substrates, advanced Multi-layer Board (MLB) full process and AI applications, DuPont will present advanced circuit materials for AI chip and server-station applications at the show.
DuPont™ Copper Gleam™ PPR-III pulse acid plating copper – As a new generation pulse electroplating for advanced MLB and AI server station applications, it is designed for excellent throwing power on through-hole to fulfill future fine line trend and reliability requirements.
DuPont™ Circuposit™ SAP8000 electroless copper – A new generation SAP metallization technology, an ionic base catalyst electroless copper process, is designed for advanced package substrates such as high-end CPU or GPU and AI chip applications.
DuPont™ Microfill™ SFP-II-M acid plating copper – A novel pattern plating solution for advanced package substrates and AI chip application, is designed for good pattern distribution on big unit sizes for high-performance computing applications.
DuPont™ Riston® DI1500 & DI1600M dry film photoresist – An advanced fine line direct imaging photoresist solution for IC substrate application, with excellent fine line adhesion and resolution as well as high-yield performance.
DuPont™ Pyralux® TFH/TFHS/GFL flexible copper-clad laminate – An industry-leading signal integrity solution for consumer electronics. DuPont’s design capabilities enable a total solution for superior insertion loss over non-in-kind while retaining the benefits of processibility and bending performance by modified Polyimide (mPI).
DuPont™ Pyralux® AP flexible copper-clad laminate – An ideal Flexible Printed Circuit (FPC) laminate solution for high-reliability applications such as aerospace, defense, automotive, telecom, industrial and medical use. Its reliability has been proven with a track record spanning around 30 years.
DuPont™ Interra® HK04J embedded capacitance laminate – A thin buried capacitance laminate designed to function as a power and ground plane in high-speed signal transmission PCB to improve power integrity for communications applications. It meets generative AI high-speed computing PCB power integrity and device minimization requirements.
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